The Joe Dieffenbacher Engineering Memorial Scholarship
Offered by Tappi.Org
- Award amount
- $5,000
- Deadline
- Offered by
- Tappi.Org
About this scholarship
The Joe Dieffenbacher Engineering Memorial Scholarship has been established by the Corrugated Packaging Council of TAPPI to be awarded to a student interested in entering the engineering area of the corrugated industry. No specific grade point average is required. Applicants must be working full-time or part-time in the corrugated industry and attending day/night school for a graduate or undergraduate degree; or be a full-time student in a two-year or a four-year college, university or technical school. Applicants must demonstrate an interest in the corrugated packaging industry related to maintenance or engineering (part-time employment or internships in the corrugated industry are looked upon in a very favorable manner). Selection of the scholarship winners will be based on the scholarship committee's opinion of overall maturity, job potential and the candidates' future contribution potential to the corrugated industry. Please visit the scholarship's website or contact the Technical Association of the Pulp and Paper Industry for more information.
Who can apply
- Study level
- Undergraduate, Graduate
- Field of study
- engineering
Apply
Applications are submitted on the sponsor's own site. Always confirm requirements and dates there before applying.
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Listing last updated .